It’s Official: Intel Breaks Ground in Ohio

On Sept. 9, President Joe Biden, Gov. Mike DeWine, Lt. Gov. Jon Husted, and other officials joined Intel leaders for the company’s official groundbreaking of its semiconductor facility in central Ohio. OMA President Ryan Augsburger attended the event.

Intel CEO Pat Gelsinger told CNBC he hopes that Ohio “becomes the largest site on the planet for semiconductor manufacturing.” Intel’s chip manufacturing in Ohio is expected to be underway by 2025 or 2026.

Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. (See separate story.)

Here are the OMA’s comments following the groundbreaking. To learn more about how the Intel project will impact Ohio and Ohio manufacturers, check out the OMA’s “Intel in Ohio” page. 9/12/2022

Joining First Lady Fran DeWine and Gov. Mike DeWine at Intel’s Sept. 9 groundbreaking in Licking County were Jay Timmons, president of the National Association of Manufacturers, and Ryan Augsburger, OMA president.